Failure analysis systematically investigates the underlying causes of a material, component, or system failure. It involves a comprehensive examination of the failed sample, often through various analytical techniques like microscopy, spectroscopy, and mechanical testing, to identify contributing factors and root causes of the failure.
The goal is to understand the underlying causes of the failure and ultimately to prevent future failures, improve product quality, and ensure safety and reliability.
JH Analytical Failure Analysis Services
- PCB, IC, and Electronic Component Failures
- Solder Joint Failures
- Contamination
- Corrosion
- Fractures, Fatigue, and Overload
- Manufacturing Defects
Related Failure Analysis Tools
- ThermoFisher Apreo S Field Emission SEM
- Oxford Ultim Max 100 EDS Detector
- Buehler AutoMet 250
- Buehler EcoMet 30
- Buehler VibroMet 2
- Leica EM TIC 3X
- Leica ACE600
- Leica DM2700M
- Leica DMi8
- Sensofar S Neox
