As components shrink, board layout complexity increases, and PCBs are employed in more and more everyday items, solder joint failures continue to plague the industry. From mismatched CTEs during thermal cycling to gold embrittlement, the rapid characterization of solder joint failures is critical in the electronics industry.
Cross-sectioning, SEM, EDS, and micro-CT are all valuable techniques employed to understand solder joint failures, ultimately contributing to the improvement of product quality and reliability.
JH Analytical Solder Joint Failure Services
- Mechanical Cross Section
- Gold Embrittlement/Elemental Analysis
- Grain Analysis and Phase Identification
- PCB/BGA Warpage Profiling
- Contamination Analysis
- X-Ray Inspection and Micro-CT
Related Solder Joint Failure Tools
- ThermoFisher Apreo S Field Emission SEM
- Oxford Ultim Max 100 EDS Detector
- Buehler AutoMet 250
- Buehler EcoMet 30
- Buehler VibroMet 2
- Leica ACE600
- Leica DM2700M
- Leica DMi8
- Sensofar S Neox
