Solder Joint Failures

As components shrink, board layout complexity increases, and PCBs are employed in more and more everyday items, solder joint failures continue to plague the industry. From mismatched CTEs during thermal cycling to gold embrittlement, the rapid characterization of solder joint failures is critical in the electronics industry.

Cross-sectioning, SEM, EDS, and micro-CT are all valuable techniques employed to understand solder joint failures, ultimately contributing to the improvement of product quality and reliability.

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