Due to the ever-increasing complexity of semiconductors, PCBs, and components, individual component reliability is as important as ever.
In the event of a failure, the identification of a failure mode and root cause is critical. These can be identified through a variety of techniques, including electrical testing, sequential isolation, mechanical cross-section, SEM-EDS, and more. Pinpointing issues in materials, design, or application can be indispensable in improving product reliability.
JH Analytical PCB, IC, and Electronic Component Failure Services
- Wire bond failures
- Capacitor failures
- IC Failures
- PTH and Stacked Microvia Failures
- Thermal Events/PCBA “Fires”
- Solder Joint Failures
- Cross Sectioning
- X-Ray Inspection & Micro-CT
- Contamination Analysis
- PCB Parallel Lapping
- Dimension and Tolerance Verification
- Sequential Fault Isolation
- Continuity Testing
- Open and Short Circuit Localization
Related PCB, IC, and Electronic Component Failure Tools
- Buehler AutoMet 250
- Buehler EcoMet 30
- Buehler VibroMet 2
- Leica EM TIC 3X
- ThermoFisher Apreo S Field Emission SEM
- Oxford Ultim Max 100 EDS Detector
- Leica ACE600
- Sensofar S Neox
