Lapping is the precise and controlled removal of material to analyze a structure layer by layer sequentially. A series of fine abrasives or lapping films are used to carefully delay the sample, creating a flat and polished surface for examination. This technique can be used to analyze PCBA thermal events or delayer semiconductor die from passivation to poly.
EBSD Analysis Becomes More Accessible with Coxem’s Tabletop SEM Electron Backscatter Diffraction (EBSD) analysis has seen a surge in popularity among materials scientists and engineers, driven by its capability to
In our latest application note, we conducted an SEM and EDS analysis of an asphalt sample to determine the composition, among other things.
In this material analysis, our team examines four toilet paper brands chosen for quality and performance based on our perception. We want to understand how the microstructure and real-world performance
Delve into the intricate world of PCB characterization, highlighting how cutting-edge technology us to enhance quality, streamline processes, and ultimately deliver superior PCBs to the market.
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