Targeted Polishing

The targeted cross-section polishing process involves the use of application-specific tooling to remove material from a sample in sub-micron step sizes selectively.

By controlling the polishing process or using a step-driven grinding tool, we can intercept extremely small features, inclusions, or defects, even if they are not externally visible.

Related Targeted Polishing Tools


Related Targeted Polishing Articles

Contact Us

Recent Posts

What Is Interferometry?

Author Tim Schoen, Lab Director, JH Technologies Understanding How Interference Patterns Reveal Surface Information Interferometry is a measurement technique used to study waves by observing the interference patterns created when

Read More »

Chemical Decapsulation

Author Tim Schoen, Lab Director, JH Technologies Access the Die. Preserve the Evidence.   Chemical decapsulation is a controlled sample preparation technique used to remove the plastic encapsulant from semiconductor

Read More »

CONTACT US