Materials Characterization / Technical Article Electron Backscatter Diffraction (EBSD) Microstructural characterization for failure analysis, process validation, and materials reliability assessment. Author: Tim SchoenRole: Lab Director, JH Technologies Technical contents Summary
Author Tim Schoen, Lab Director, JH Technologies Access the Die. Preserve the Evidence. Â Chemical decapsulation is a controlled sample preparation technique used to remove the plastic encapsulant from semiconductor
Author William Bond , Lab Manager, JH Technologies What looks perfect under the optical microscope can still produce poor EBSD data. Electron Backscatter Diffraction (EBSD) has become one of the
Author Tim Schoen, Lab Director, JH Technologies Understand What Your Material Is Made Of When a contaminant, corrosion site, or unknown particle appears, EDS analysis from JH Technologies helps identify
Author Tim Schoen, Lab Director, JH Technologies A proven, cost-effective technique for identifying failure mechanisms in BGA, CSP, and other advanced electronic assemblies. Why Dye & Pull Analysis Matters As
Author Ken Hirsch, Yi Zhang (PhD), JH Technologies, Applications Scientists Faster Analysis with Less Sample Preparation: A Practical Summary Paper Towel No Coat Low Vac EXECUTIVE SUMMARY For decades, Scanning
Author Yifan Jiang, Phd. JH Technologies, Applications Scientist Technical Overview: Sample Preparation of Ti-6Al-4V Alloy for EBSD Analysis Titanium Alloy Introduction Titanium and its alloys are widely used in energy,
 Author Micah Harrel, CTO, JH Technologies Imaging a 16th-Century Spanish One Real with Modern Tools For my high school graduation—many moons ago—I received an unusual gift: four Spanish silver coins
SERIES Part 1: The Journey of an Electronic Device Through the Analytical Lab In the first article of this series, you will experience the steps of a typical workflow used
JH Technologies often receive questions from people asking us what we do and why we do it. We see many types of samples, questions, and requests from R&D to failure
